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Verification of Cleanability for Long Edge Resistance [Joint Research with Japan Superior Co., Ltd.]

Introduction to the joint research between Nippon Superia Co., Ltd. and Zestron Japan!

Long-side resistors refer to a type of chip resistor (resistor) on a substrate where the electrodes are arranged along the long side of the component. In recent years, there has been an increase in cases where they are used for high functionality and long-term stability. In this instance, we created a test board using general-purpose rectangular resistors (2012) and long-side resistors (1220), and conducted substrate cleaning using a cleaning agent primarily composed of water (manufactured by Zestron / VIGON PE 304N) and a general-purpose solvent-based cleaning agent primarily composed of organic alkali. For this verification, we received cooperation from Japan Superior, a solder manufacturer, and conducted a detailed analysis comparing the cleanability of both types of resistors. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.

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  • Printed Circuit Board
  • Other cleaning machines
  • Cleanability verification

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Verification of Cleaning Properties of New Halogen-Free Solder Paste [Joint Research]

Introduction to the morphological changes in flux residues after soldering and their impact on cleanability.

Solder paste is required to have characteristics such as halogen-free and high wettability in high-reliability areas like the automotive industry. However, even in high-reliability fields, there is a demand for residue-free performance, even for no-clean types, and there are situations where cleaning is necessary. This paste contains difficult-to-dissolve substances that make effective cleaning challenging with conventional "solvent cleaning" methods, revealing issues related to cleaning. Therefore, we conducted cleaning performance verification in collaboration with the developers of the paste. Detailed information can be viewed through the related links. *Detailed information can be viewed through the related links. *The PDF document is a technical material that explains the evolution and challenges of power devices.

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  • Cleaning agents
  • Cleanability verification

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Verification of the cleanliness of fine joining solder paste.

Introducing a comprehensive cleanliness evaluation case using FT-IR and SEM-EDS! This highlights the importance of analysis in the cleaning of fine joints.

As electronic devices become more advanced and compact, the importance of fine solder paste in high-reliability fields such as power semiconductors, automotive, and industrial equipment is increasing. However, the growing demand for reduced electrode spacing, fine pitch, and low stand-off mounting has brought to light the risks associated with flux residue after soldering, which previously did not pose a problem, affecting insulation reliability and the quality of subsequent processes. For these reasons, there is an increasing number of situations where a decision must be made regarding whether or not to perform flux cleaning from the perspective of ensuring reliability, making the cleaning of high-performance solder paste and flux a new challenge. In this study, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine bonding" developed by the company, examining the cleaning characteristics in fine bonding and verifying the usefulness of evaluation through FT-IR and SEM-EDS based on chemical analysis. *For detailed content of the article, please refer to the related link. For more information, feel free to download the PDF or contact us directly.*

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  • Other analysis and evaluation services
  • Cleanability verification

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